Spark Plasma Sintering (SPS)

Retech has teamed up with GeniCore to represent their Spark Plasma Sintering (SPS) technology in the North American market. Spark Plasma Sintering (SPS) technology, also called Field Assisted Sintering Technology (FAST), enables effective consolidation of pure metal powders, metal alloys, as well as ceramic and metal composites using pulsed direct current. The SPS process bonds materials using a combination of pressure and thermal energy applied to materials in a mold. It resembles Hot Pressing, but the SPS process consumes far less energy and, most importantly, can bond a broader range of materials into novel composites unachievable by other processes. The “spark” in spark plasma sintering is more of a powerful pulse of electric current that passes directly through the material in the mold form while it is under pressure. To withstand the heat and pressure, the molds are made of graphite, which is machined into a negative shape. As the material is compressed in the mold while under vacuum, a pulse of direct current is passed through the material, producing the high temperatures necessary for sinter bonding to occur. The current pulse heats the material via Joule heating rather than radiant, applying the heat only where needed, thereby using less energy than traditional hot pressing or sintering methods. GeniCore’s pioneering advancement in SPS/FAST technology is in their Direct Current (DC) electric pulse switching, enabling the most precise DC waveform control in the emerging SPS industry — controlling each pulse’s current, duration, and spacing -- hence the name Upgraded Field Assisted Sintering Technology (U-FAST). Generating pulses of under one millisecond, and even, precisely programmable square-pulse packets, delivers tremendous energy directly into the materials being consolidated. This precision pulse control, in turn, breeds the greatest precision in sintering, resulting in uniform consolidation with minimal grain growth. Process trials yield material compositions unachievable by any other processes. GeniCore U-FAST devices are available in the four different configurations listed below to accommodate varying applications, part sizes, production throughput, and budgets. Additionally, the modular design allows for any of the configurations to be upgraded to the next larger model.

GeniCore U-FAST (SPS) Compact

A Small, Powerful, Precise, and budget-friendly U-FAST solution to support innovation. U-FAST Compact offers the same quality performance but with lower initial investment and lighter infrastructure requirements.

Materials:

Transparent ceramics, sintered carbides, Bulk Metallic Glasses, Thermoelectrics, High-Entropy Alloys, Super Enhanced Ceramic Whiskers (SEC-W), Ballistic Plates , Composite tooling, High thermal-conductivity substrates.

Applications:

Producing small parts for R&D, trial batches.

Download GeniCore U-FAST Brochure

GeniCore U-FAST (SPS) GC

The GeniCore U-FAST GC model is a perfect fit for R&D scale and small batch production needs. It is designed for tech enterprises with R&D departments and manufacturing businesses developing and experimenting with new materials prior to scaling up to full scale production volumes.

Materials:

Applications:

R&D, Low-Volume Production

Download GeniCore U-FAST Brochure

GeniCore U-FAST (SPS) Hybrid

GeniCore’s U-FAST Hybrid pairs SPS technology with induction heating to achieve the same uniform material quality in larger parts than can be achieved by SPS alone. As part sizes increase, current density becomes more irregular. The irregular current density can be compensated for using induction heating, extending U-FAST part size up to 200mm. The independently controlled induction heating also shortens cycle time to achieve higher production throughput.

Materials:

Applications:

Capable of producing larger parts, up to 200mm diameter. High production throughput.

Download GeniCore U-FAST Brochure

GeniCore U-FAST (SPS) MASS

U-FAST MASS stands at the forefront of sintering technology, particularly as an automatic sintering machine ideal for large-scale production. Designed for industries seeking efficiency, precision, and scalability. U-FAST MASS not only continues to push the boundaries in the world of SPS systems but also heralds a new era in advanced composite material manufacturing.

Materials:

Applications:

Fully Automated Large-scale Continuous Production

Download GeniCore U-FAST Brochure

Spark Plasma Sintering (SPS) FAQ’s

GeniCore’s systems are based on SPS / FAST (Field Assisted Sintering Technology), where powder materials are consolidated at solid state under pressure with the aid of very short electric current pulses, producing high heating rates and enabling full densification at lower temperature with limited grain growth.

GeniCore’s U-FAST machines deliver ultra-short current pulses (below 1 ms) allowing for extremely fast energy delivery, which minimizes the exposure time of the material to high temperatures. This is crucial for preserving the nanostructure and limiting grain growth. Longer pulses can lead to local overheating and uncontrolled grain growth.

The machines support a wide materials range: metals (Fe, Cu, Al, AuAg, Ni, Cr, Mo, Sn, Ti, W), carbides (SiC, TiC, ZrC, WC), ceramic oxides (Al₂O₃, ZrO₂, TiO₂, MgO), borides (TiB₂, ZrB₂, VB₂), nitrides (TaN, TiN, ZrN), high-entropy alloys, thermoelectrics (e.g., PbTe), transparent ceramics, amorphous alloys, composites with ceramic matrices, and more.

o Compact: R&D scale, development of new materials (smaller parts). o GC: R&D to small-batch production, somewhat larger capacity. o Hybrid: For larger parts (up to ~200 mm diameter), uses SPS + induction heating to maintain uniform temperature distribution. o MASS: Fully automated, continuous production machine, for large-scale industrial production. o U-FAST Glovebox: For oxygen-/moisture-sensitive materials; inert-atmosphere R&D and small-batch production.

Yes — GeniCore emphasizes modular architecture. For example, in the Glovebox variant “U-FAST Glovebox (GC)” they note you can upgrade from GC55 to GC85-HV without replacing the base system. In general, the product pages mention modular upgrade paths.

o Much shorter sintering times (thanks to rapid heating via pulses) o Much lower sintering temperatures (thank to short current pulses) o Reduced grain growth (benefitting mechanical/optical properties) o Energy efficiency — because electrical pulses heat the tooling and powder directly, not the entire furnace volume.

The technology is used in tooling, mining, SMRs, advanced electronics, luxury goods, additive manufacturing feedstock, thermoelectrics, optical lenses, transparent ceramics, piezoceramics, high-entropy alloys, high temperature ceramics, and more.

o The machine requires colling system (chiller) and inert-gas systems (in many cases) for best results (especially for sensitive materials). o Die tooling (often graphite molds) is required, especially in SPS processes. o For large part sizes, cooling and temperature uniformity become critical — e.g., in the Hybrid system the cooling stage is a key design consideration.

Temperature is measured by pyrometers (with optional thermocouples) and controlled via PLC logic with programmable multi-step heating profiles.

The sample diameters up to about 200 mm for the Hybrid, and for other models smaller sizes.

For the U-FAST MASS, for example, the vacuum system is designed to achieve operational vacuum in ~60 seconds via a 3-chamber design.

o While many materials are supported, you must consider tooling (dies), electrical connection, vacuum/inert atmosphere, and process parameters. o Large diameters may require additional heating and cooling strategies (as noted in Hybrid model). o The upfront investment and infrastructure (vacuum/inert gas, water cooling, power supply) may be higher compared to very simple setups, though the operational benefits often outweigh this.

Key factors include: desired part size/diameter, throughput (R&D vs production), choice of material (sensitive vs tolerant), budget and infrastructure, upgrade path, plus whether inert atmosphere or glovebox integration is required. Retech (as the North America representative) can assist with selecting the appropriate model, upgrade path, and support.